Flow control system, method, and apparatus

ABSTRACT

In one embodiment, a system for controlling the delivery of process gas has a first mass flow device and a pressure transducer. The first mass flow device has a substrate block with an inlet conduit and an outlet conduit. A proportional valve having a first valve body is mounted to the substrate block and fluidly connected to the inlet conduit. A characterized restrictor is fluidly connected to the proportional valve and the outlet conduit.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. patent applicationSer. No. 15/087,130, filed Mar. 31, 2016, which is (1) a continuation inpart of U.S. patent application Ser. No. 14/854,043, filed Sep. 15,2015, which is a continuation of U.S. patent application Ser. No.13/590,152 (now U.S. Pat. No. 9,188,989), filed Aug. 20, 2012, which inturn claims the benefit of U.S. Provisional Patent Application No.61/575,359, filed Aug. 20, 2011; (2) a continuation in part of U.S.patent application Ser. No. 14/022,165 (now U.S. Pat. No. 9,690,301),filed Sep. 9, 2013, which in turn claims the benefit of U.S. ProvisionalPatent Application No. 61/743,748, filed Sep. 10, 2012; (3) acontinuation in part of U.S. patent application Ser. No. 14/183,494 (nowU.S. Pat. No. 9,448,564), filed Feb. 18, 2014, which in turn claims thebenefit of U.S. Provisional Patent Application No. 61/850,503, filedFeb. 15, 2013; and (4) continuation in part of U.S. patent applicationSer. No. 14/887,334, filed Oct. 20, 2015, which is (a) a continuation inpart of U.S. patent application Ser. No. 14/700,125, filed Apr. 29,2015, which in turn claims the benefit of U.S. Provisional PatentApplication No. 61/996,146, filed Apr. 29, 2014, and (b) a continuationin part of U.S. patent application Ser. No. 13/590,152 (now U.S. Pat.No. 9,188,989), filed Aug. 20, 2012, which in turn claims the benefit ofU.S. Provisional Patent Application No. 61/575,359, filed Aug. 20, 2011,the entireties of which are incorporated herein by reference.

BACKGROUND

Mass flow control has been one of the key technologies in semiconductorchip fabrication. Mass flow controllers (MFCs) are important componentsfor delivering process gases for semiconductor fabrication. An MFC is adevice used to measure and control the flow of fluids and gasses.

As the technology of chip fabrication has improved, so has the demand onthe MFC. Semiconductor fabrication processing increasingly requiresincreased performance, including more accurate measurements, lowerequipment costs, greater speed, more consistency in timing in thedelivery of gases, and space-saving layouts.

BRIEF SUMMARY

Disclosed are gas delivery methods, systems, and apparatus. In oneembodiment, a control apparatus for delivery of a process gas includesan inlet conduit; a valve operably coupled to the inlet conduit andalterable between an open condition and a closed condition, the valvehaving a first conductance and being downstream of the inlet conduit; acharacterized restrictor operably coupled to the valve, thecharacterized restrictor having a second conductance and beingdownstream of the valve; and an outlet conduit operably coupled to thecharacterized restrictor and being downstream of the characterizedrestrictor; wherein a ratio of the first conductance to the secondconductance is 10:1 or higher.

In one embodiment, an apparatus (e.g., a flow node) operates inconjunction with an upstream, remotely-located pressure regulation forcontrolled delivery of process gas. The apparatus includes a valvecontrolled by an actuator to receive a process gas into a conduit. Acharacterized restrictor is placed in series and adjacent with the valveseat to provide a primary flow restriction while having a minimizedvolume between the valve seat and the characterized restrictor.

In one embodiment, a conductance of the characterized restrictor is lowenough relative to a conductance of the valve seat that the valve seatcreates a negligible pressure drop compared to the pressure drop createdby the characterized restrictor. Once the process gas has passed throughthe characterized restrictor, an outlet exhausts the process gas fromthe conduit. By knowing the characterization of the restrictor, andaccordingly controlling a pressure of the process gas, the desired massflow is delivered.

In one embodiment, a pressure measurement device, such as a pressuretransducer, is located within an upstream pressure regulator such as anelectronic regulator. In another embodiment, a vent is provided to bleeddown the process gas. As a result of venting, the process gas pressurecan be quickly reduced.

In some embodiments, a plurality of parallel flow nodes provides a widerdynamic range of flow rates in less space than a standard MFC and withless cost than providing multiple MFC to cover an equivalent operatingrange. For example, one flow node can be activated for low flow rates,while another flow node can be activated for higher flow rates. Further,the flow nodes can share an upstream pressure measurement and controldevice and an outlet. Numerous other embodiments are possible, asdescribed in more detail below. Advantageously, space and cost arereduced, while improving a dynamic range relative to other MFC devices.

In yet another embodiment, an MFC has a standard envelope with anenclosure and a corresponding base. A pressure transducer iscommunicatively coupled to a process gas in a proportional inlet valvewithout being physically coupled to the base. The space on the base,formerly occupied by the pressure transducer, is available foradditional component integration. In one embodiment, a second pressuretransducer is located remotely and shared by multiple MFCs.

In another embodiment, an envelope is smaller than the standards. Apressure transducer is communicatively coupled to a process gas in aninlet valve without being physically coupled to the base. In this case,the components are arranged to be more compact in view of space formerlyoccupied by the pressure transducer. While this shorter embodiment doesnot fit the larger current interface standards it is obvious that makinga device larger is easier than making one smaller and the smaller devicemight be readily expanded to fit current applications or be adopted asthe new future interface standard that is periodically adopted.

In an embodiment, an MFC utilizes a second pressure transducer that isremotely located downstream from the MFC.

In another embodiment, an MFC has a self-relieving P1 pressure.

In still another embodiment, an MFC has a first LFE and a second LFEconfigured in parallel to produce a wide-range MFC that maintains itsaccuracy over a range that previously required two separate MFCs.

Additionally, a mini IGS style MFC, which utilizes the smaller squareinterface currently used by air valve, can have a pressure transducercommunicatively coupled to a process gas in a proportional inlet valvewithout being physically coupled to a base. Optionally, a ventingorifice can be provided.

Advantageously, the MFC layout provides additional space on a standardMFC envelope, and the MFC layout allows a smaller MFC envelope.

In yet another embodiment, to provide a gas delivery apparatus to outputa process gas as rapid square waves by increasing a time constant, atime constant is increased, leading to improved rapid square waves foroutput from gas flows out of an accumulation volume between a gassupplying component (e.g., an MFC or electronic regulator) and an on-offvalve. To do so, a high impedance flow restrictor is added in serieswith a valve seat of the on-off valve. An enclosure is attached to abase with a conduit channeling through the base to receive a supply ofthe process gas and output the process gas from the gas deliveryapparatus to the semiconductor process.

In another embodiment, a wave generation component comprises a gassupply component or system and the on-off valve downstream from the gassupply component, coupled to receive the process gas in the conduit. Thewave generation component during an off cycle when the on-off valve isclosed to build pressure from the process gas in an accumulation volume.During an on cycle when the on-off valve is open the wave generationcomponent releases the process gas according to a time constant.

In an embodiment, a flow restrictor installed in a throat of the on-offvalve, outputs the rapid square waves of flow to the conduit at apredefined magnitude and duration. The flow restrictor is selected tohave an impedance that is high enough to significantly raise the timeconstant of the flow out of the accumulation volume, during the oncycle, such that flow decay in each square wave pulse over the on cycledecreases to within a tolerance, wherein the time constant is at leastin part a function of the flow restrictor impedance.

Advantageously, rapid square waves are produced with an initial flow ata desired magnitude and duration during an on cycle, with the magnituderemaining nearly constant.

In yet another embodiment, a gas delivery apparatus comprises an MFC, aflow node and associated electronic regulator, sensors and controlsystem, or any related device that depressurizes (bleeds down) anaccumulation volume by switching from a default forward flow mode, froma gas supply, to a reverse flow mode out of the accumulated volume. Morespecifically, an electronic regulator of the apparatus can open andclose its proportional valve in accordance with control coefficients ina PID controlled manner or it can open and close its proportional valvein a more basic, fully open or fully closed “On/Off” or “Bang/Bang”manner. Variable restriction from the proportional valve controls apressure of an accumulation volume located downstream from the gassupply. The most rapid depressurization will occur if, assuming actionsare taken to reduce the pressure in front of the valve, when theproportional valve opens fully immediately when commanded, i.e. “bangopen”. However, this technique can introduce variability in thedepressurization timing and final pressure value. If more control of thedepressurization timing and final pressure is desired for theaccumulation volume, PID control of the proportional valve can be usedin conjunction with feedback from the existing pressure transducer andother algorithms. In one embodiment, during a forward flow mode, aproportional valve is further opened for increasing target pressure whenan upstream pressure is greater than a downstream pressure of theaccumulated volume. By contrast, during the reverse flow mode, theproportional valve is further opened for decreasing target pressure whenthe upstream pressure is less than the downstream pressure of theaccumulated volume.

In some embodiments, a purge valve and a gas supply valve are locatedupstream of the proportional valve being adjusted. Initially, in theforward flow mode, the gas supply valve is open and the purge valve isclosed to build up pressure on the proportional valve. Pressure isdecreased on the proportional valve when switching to the reverse flowmode by closing the gas supply valve and opening the purge valve. As aresult, the pressure drop in combination with further opening theproportional valve, quickly evacuates process gas from the accumulatedvolume through the purge valve while in the reverse flow mode.

One implementation utilizes a characterized restrictor disposeddownstream of the proportional valve and the accumulated volume togenerate a specific mass flow rate based on a pressure of theaccumulated volume. In one example, depressurization reduces a firstmass flow rate to a second mass flow rate for the same process gas.

In one embodiment, a system for controlling the delivery of process gashas a first mass flow device and a pressure transducer. The first massflow device has a substrate block with an inlet conduit and an outletconduit. A proportional valve having a first valve body is mounted tothe substrate block and fluidly connected to the inlet conduit. Acharacterized restrictor is fluidly connected to the proportional valveand the outlet conduit.

In another embodiment, a system for processing articles include firstand second flow controllers. Each of the first and second flowcontrollers have a printed circuit board, an inlet conduit, and anoutlet conduit. The outlet conduits of the first and second flowcontrollers are fluidly connected. A pressure transducer is also fluidlyconnected to the outlet conduits of the first and second flowcontrollers. Measurements from the pressure transducer are received bythe printed circuit boards of the first and second flow controllers.

In some embodiments, a system for processing articles include first andsecond flow controllers. Each of the first and second flow controllershave a proportional valve, an inlet conduit, and an outlet conduit. Theoutlet conduits of the first and second flow controllers are fluidlyconnected. A pressure transducer is also fluidly connected to the outletconduits of the first and second flow controllers. Measurements from thepressure transducer control operation of the proportional valves of thefirst and second flow controllers.

Advantageously, semiconductor processing efficiency is improved through(1) faster transition response times for process gas delivery,particularly at low flow rates and (2) more accurate flow control atlower flow rates. Additionally, lower flow rates than currently usedbecome practical as smaller full scale devices can be built with lowerconductance restrictors because the bleed down time limitation of 4seconds, or similar, can readily be met for all restrictors given thisreverse flow operation as described.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention of the present disclosure will become more fullyunderstood from the detailed description and the accompanying drawings,wherein:

FIG. 1A is a schematic diagram illustrating a pressure based MFC with avolume (V1) to measure pressure.

FIG. 1B is a block diagram of FIG. 1A illustrating a flow order for aprocess gas through a pressure based MFC.

FIG. 2A is a schematic diagram illustrating a gas stick including a flownode with a remote pressure measurement, according to an embodiment.

FIG. 2B is a block diagram of FIG. 2A illustrating a flow order for aprocess gas though a gas stick including a flow node making use of aremote pressure measurement, according to an embodiment.

FIGS. 3A-3B are schematic diagrams illustrating alternativeconfigurations of a valve relative to a characterized restrictor,according to some embodiments.

FIGS. 4A-4C are schematic diagrams illustrating alternativeconfigurations of multiple flow nodes, according to some embodiments.

FIG. 5A is a block diagram illustrating a flow node supplied by aself-venting electronic regulator, according to some embodiments.

FIGS. 5B-5C are schematic diagrams illustrating an electronic regulatorof FIG. 5A used in conjunction with self-venting mechanisms, accordingto some embodiments.

FIG. 6 is a flow chart illustrating a method for delivering a processgas making use of a remote pressure measurement device and flow node,according to an embodiment.

FIG. 7 is a schematic diagram illustrating a layout of a pressure basedMFC with a P1 pressure transducer coupled to a base within a standardenvelope.

FIG. 8A is a schematic diagram illustrating a layout for a pressurebased MFC with a P1 pressure transducer decoupled from a base for asmaller envelope, according to an embodiment.

FIG. 8B is a schematic diagram illustrating a layout for a pressurebased MFC with a P1 decoupled from the base and with space for anadditional component to be coupled to a base within a standard envelope,according to an embodiment.

FIG. 9 is a schematic diagram illustrating a layout for a pressure basedMFC with a P1 pressure transducer decoupled from A base and a reliefvalve coupled to the base for rapidly reducing the pressure upstream ofthe restrictor, to within a standard envelope, according to anembodiment.

FIG. 10 is a schematic diagram illustrating a layout for a pressurebased MFC with A P2 pressure transducer decoupled from a base andlocated remote to the envelope, and a relief valve coupled to the base,according to an embodiment.

FIG. 11 is a schematic diagram illustrating a layout for a pressurebased MFC with a P1 pressure transducer decoupled from a base and asecond laminar flow element (LFE), which can be functionally active orinactive by the opening or closing of a high conductance valve in serieswith the LFE, according to an embodiment.

FIG. 12 is a schematic diagram illustrating a layout for a pressurebased MFC with a P1 pressure transducer decoupled from a base and thesecond LFE, and a relief valve, according to an embodiment.

FIG. 13 is a schematic diagram illustrating a layout for a pressurebased MFC with a P1 pressure transducer decoupled from a base and asecond LFE, and a relief valve, and a P2 pressure transducer decoupledfrom the base and located remote to the envelope, according to someembodiments.

FIG. 14 is a layout for a schematic diagram illustrating a miniintegrated gas system (IGS) with a P1 pressure transducer decoupled fromthe base, and a P2 pressure transducer remotely located, according to anembodiment.

FIG. 15 is a layout for a schematic diagram illustrating a mini IGS witha P1 pressure transducer decoupled from a base, a venting orifice, and aP2 pressure transducer remotely-located, according to an embodiment.

FIG. 16 is a graph of test data collected using special instrumentationto show an output wave produced by a MFC-based system having anundesirable initial spike.

FIG. 17A is a graph illustrating the results of a computer simulationshowing a series of square output waves produced by a gas deliverysystem with a properly sized and installed flow restrictor, inaccordance with an embodiment of the present invention

FIG. 17B is a graph of square output waves produced by a gas deliverysystem with a property sized and installed flow restrictor, and anincreased accumulation volume, in accordance with an embodiment of thepresent invention.

FIG. 18 is a flow chart illustrating a method for producing square wavesin a gas delivery system, according to an embodiment of the presentinvention.

FIGS. 19A-D are graphs illustrating time constant decay for a linear gasdelivery system, according to one embodiment of the present invention.

FIG. 20 is a high-level schematic diagram conceptually illustrating asystem 500 to produce a square wave using an MFC, according to oneembodiment of the present invention.

FIG. 21 is a schematic diagram illustrating a system 600 to produce asquare wave using a flow node, according to one embodiment of thepresent invention.

FIG. 22 is a schematic diagram illustrating a system to produce a squarewave using a mixture of gases, according to one embodiment of thepresent invention.

FIG. 23 is a more detailed schematic diagram illustrating an exemplarysystem to produce a square wave, with a relief valve and an accumulationchamber, according to one embodiment of the present invention.

FIG. 24 shows graph with a series of square output waves produced by agas delivery system with an electronic regulator versus a series ofsquare output waves produced by a gas delivery system with an MFC,according to one embodiment of the present invention.

FIG. 25 is a perspective diagram illustrating a gas delivery apparatusutilizing a reverse flow mode for fast bleed down of an accumulatedvolume, according to one embodiment.

FIGS. 26-27 are a more detailed block diagram illustrating a view of anelectronic regulator of a gas delivery apparatus, according to anembodiment.

FIGS. 28A-B are block diagrams illustrating more abstract views ofcomponents involved in a forward flow mode and in a reverse flow mode,according to an embodiment.

FIG. 29 is a flowchart diagram illustrating a method for utilizing areverse flow mode for fast bleed down of an accumulated volume,according to an embodiment.

FIG. 30 is a more detailed flowchart diagram illustrating a step oftransitioning from a forward flow mode to a reverse flow mode, accordingto an embodiment.

FIG. 31 is a perspective diagram illustrating a gas delivery apparatusutilizing a reverse flow mode for fast bleed down of an accumulatedvolume, according to an embodiment.

FIG. 32 is a perspective diagram illustrating a gas delivery apparatusutilizing a reverse flow mode for fast bleed down of an accumulatedvolume, according to an embodiment.

DETAILED DESCRIPTION

The following description of the preferred embodiment(s) is merelyexemplary in nature and is in no way intended to limit the invention orinventions. The description of illustrative embodiments is intended tobe read in connection with the accompanying drawings, which are to beconsidered part of the entire written description. In the description ofthe exemplary embodiments disclosed herein, any reference to directionor orientation is merely intended for convenience of description and isnot intended in any way to limit the scope of the present invention.Relative terms such as “lower,” “upper,” “horizontal,” “vertical,”“above,” “below,” “up,” “down,” “left,” “right,” “top,” “bottom,”“front” and “rear” as well as derivatives thereof (e.g., “horizontally,”“downwardly,” “upwardly,” etc.) should be construed to refer to theorientation as then described or as shown in the drawing underdiscussion. These relative terms are for convenience of description onlyand do not require that the apparatus be constructed or operated in aparticular orientation unless explicitly indicated as such. Terms suchas “attached,” “affixed,” “connected,” “coupled,” “interconnected,”“secured” and other similar terms refer to a relationship whereinstructures are secured or attached to one another either directly orindirectly through intervening structures, as well as both movable orrigid attachments or relationships, unless expressly describedotherwise. The discussion herein describes and illustrates some possiblenon-limiting combinations of features that may exist alone or in othercombinations of features. Furthermore, as used herein, the term “or” isto be interpreted as a logical operator that results in true wheneverone or more of its operands are true.

The disclosure is divided into four sections. Section I discusses adevice and method for delivering process gas using a remote pressuremeasurement device. Section II discusses an MFC device with space savinglayouts and improved functionalities. Section III discusses a gasdelivery apparatus to output a process gas as rapid square waves offlow. Section IV discusses an electronic regulator utilizing reverseflow for fast bleed down of gas pressure in a gas delivery apparatussupplying a process gas at specific mass flow rates to a process.Different embodiments disclosed in the respective sections can be usedtogether as part of a gas delivery apparatus, method, or system. To theextent a term, reference number, or symbol is used differently indifferent sections, context should be taken from the relevant sectionand not the other sections.

Section I

FIG. 1A is a schematic diagram illustrating a pressure based MFC 1100with a volume (V1) in conduit 1198A that is used to measure pressure.MFC 1100 has an inlet port 1101A, an outlet port 1102A, a proportionalinlet valve 1103A, a first pressure transducer 1104A, a restrictor1105A, a second pressure transducer 1106A and a temperature sensor1107A. The first pressure transducer 1104A measures pressure over V1 asan input for pressure regulation and is operates so that pressure at thefirst pressure transducer 1104A closely matches the pressure at an inletof the restrictor 1105A. The second pressure transducer 1106A is locateddownstream and a temperature sensor 1107A is used to increase accuracy.

FIG. 1B is a block diagram of FIG. 1A illustrating a flow order for aprocess gas through the pressure based MFC 1100B. As shown, a processgas moves through a proportional valve 1103B to a conduit containing V11198B where the process gas is measured by a first pressure transducer1104B. Next the gas passes through restrictor 1105B into a conduit withvolume V2, 1199B, where the pressure representative of the pressure atthe outlet of the restrictor is measured. Finally, the process gas oftenexhausts from the MFC 1100B to a process through an isolation valveactuator and seat 1110.

Problematically, the space consumed by V1 hinders further efficienciesin accuracy, bleed down performance, space consumption and costs of gasdelivery systems used for processing. Furthermore, when an externalcontrol directs the MFC to stop or reduce the magnitude of the gas flowto a lower rate of flow, V1 produces undesirable slow bleed down timesto the new flow value.

What is needed is a flow node to provide an accurate delivery of processgas without the inefficiencies of MFCs having a local pressuremeasurement directly on V1, by utilizing a remote pressure measurementof V1 pressure to reduce the bleed down volume while still providingpressure measurements that represent the pressure of the gas inlet tothe restrictor with sufficient accuracy to maintain the specifiedaccuracy of the flow device.

A device and method for a flow node to control gas flow utilizing aremote pressure measurement device are disclosed. In general, the flownode disclosed herein eliminates the local pressure measurement directlyon V1 needed by MFCs because a resulting pressure drop across conduitsand poppet and valve seat of the flow node is designed to beinsignificant relative to the remote measurement. The disclosedtechniques can be implemented in a semiconductor fabrication process, orany other environment requiring flow rates of gas or fluid (e.g., lowflow, high flow, 0.1 sccm, or 30,000 sccm) within tight tolerance limitsor where reduced equipment cost is desired.

FIG. 2A is a block diagram illustrating a gas stick 1200A that includesa flow node 1201A making use of a remote pressure measurement, accordingto an embodiment. The gas stick 1200A also includes an electronicregulator 1202A and an inlet 1203A and outlet 1204A to a conduit.

The inlet 1203A of a VCR fitting (e.g., as produced by ParkerCorporation) receives a process gas into a conduit. Nitrogen is anexemplary process gas, but any suitable gas or fluid could besubstituted. The conduit(s) can be any suitable tubing or plumbing,either rigid or flexible, to move the process gas through and to theelectronic regulator 1202A and the flow node 1201A. The conduit can havean outside diameter of, for example, ¼ inch and inside diameter of 3/16inch. K1S substrate blocks 1203, as manufactured by Hytron Corporation,serve as an interconnecting platform for the electronic regulator 1202A,the flow node 1201A and the inlet conduit 1203A and outlet 1204Aconduit.

The outlet 1204A of a VCR fitting delivers the process gas to a nextconduit for eventual use by the process. In some embodiments, additionalprocessing is performed on the process gas, such as mixing with othergases, or the like.

The flow node 1201A includes a valve seat and poppet assembly 1205A, anactuator 1222 (represented by the arrow up/down arrow), internalconduits 1207 (can represent one or more portions of conduit), interfacesealing surfaces 1208 and a characterized restrictor 1209A. The flownode 1201A is connected in series with an upstream electronic regulator1202A having a pressure transducer 1206A. Generally, the flow node 1201Alimits a mass flow of gas or liquids that is in accordance with apressure of a gas or liquids as measured upstream. Optionally a pressuremeasurement and/or temperature assumed, measured or communicated byother instrumentation elsewhere in the system can be used to improve theaccuracy of the flow if available.

The valve seat and poppet assembly 1205A includes an opening for gasflow and a movable poppet to preclude gas flow. In operation, the poppetmoves between on and off by opening to allow process gas to flow intothe conduit and closing to stop the process gas. In one embodiment, thevalve seat has a high conductance relative to the characterizedrestrictor 1209A (or alternatively, has low impedance relative to thecharacterized restrictor), for example, a ratio of 10:1, 200:1(preferred) or higher. The conductance of an on/off valve such as usedin the flow node, can be the maximum practical amount for a designenvelope. With an MFC using a proportional valve as opposed to an on/offisolation valve, conductance has to be balanced with (and thus, islimited by) flow resolution needs.

The characterized restrictor 1209A is located, in one embodiment,directly adjacent to and in series with the valve seat and poppetassembly 1205A. The characterized flow restrictor 1209A can be a laminarflow element (compressible or in-compressible flow), an orifice (sonic,sub sonic or molecular), a venturi nozzle (sonic, sub sonic ormolecular), or the like. As discussed, the characterized restrictor1209A is selected to provide the desired full-scale flow at or slightlybelow the target full scale pressure to be delivered to the flow node1201A and still have a low conductance relative to a conductance of thevalve seat. A resulting pressure drop from the pressure regulatoroutput, through the conduits to the flow node 1201A and across the valveseat of the flow node 1201A is small enough to be ignored so that apressure measurement within the flow node 1201A is not required toachieve a desired accuracy.

For example, a characterized restrictor designed to flow 5,000 sccm atP1=2000 Torr is placed in the throat of an air valve with a flowimpedance and associated plumbing that generates, for instance, a 0.15Torr pressure drop when delivering the 5000 sccm flow through therestrictor at 2000 Torr. The induced flow error would be roughly 0.15%of reading if the characterized restrictor is a compressible laminarflow element. The 0.15% is well within the 1% reading of the device andis acceptable allowing the device to maintain it specified accuracy.

An electronic regulator 1202A with the pressure 1206A transducer and aproportional valve 1211A measures and correspondingly controls apressure of the process gas within the conduit. A proportional valve1211A of the electronic regulator 1202A modulates to control a pressureof the process gas inlet in accordance with pressure set points. Thepressure set points can be received automatically from a controller ormanually input. In some embodiments, the pressure set points areexternally calculated to cause a desired mass flow rate. In someembodiments, the electronic regulator can maintain accuracy from anupstream location for flows up to 8 SLM (standard liter per minute) onN2 (nitrogen) or 4 SLM on SF6 (sulfur hexafluoride) for flow nodes usinga ¼″ air valve commonly used in the industry. In other embodiments, flowrates can be higher if larger standard components or non-standardmodified components are used. At a certain point as flow rate getslarger, parasitic losses of pressure across the valve seat make theoverall pressure drop larger, relative to the pressure delivered to therestrictor 1209A, than manageable to maintain flow measurement accuracy.

FIG. 2B is a block diagram of FIG. 2A illustrating a flow order for aprocess gas though a gas stick 1200B that includes a flow node 1201Bwith a remote pressure measurement, according to an embodiment.

The gas is received through an inlet 1203B to a proportional valve 1211Bthat is modulated in coordination with a pressure transducer 1206B tocontrol pressure to the 1201B flow node. A volume 1298 for bleed downbetween the valve seat and poppet assembly 1205B and the characterizedrestrictor 1209B is minimized for faster bleed down (e.g., 50× faster).By minimizing the distance and geometry, the volume 1298 of gas betweenthe components is minimized. An exemplary volume of the resulting bleedoff volume can be a negligible at 0.02 cc, 0.01 cc or less. As shown inFIG. 1B, an exemplary bleed off volume of an MFC can be 0.50 cc.Optionally, a temperature sensor 1252 provides an internal temperaturemeasurement, although temperature can also be received from externalcomponents such as a gas box temperature controller or sensor.

Additionally, the MFC has typical measurements of 1.1″ (W)×4.1″ (L)×5″(H), compared to a flow node constructed from an air valve havingmeasurements of 1.1″ (W)×1.1″ (L)×4′ (H) for similar operationalparameters. Further, the pressure based MFC can cost $2,500, while anair valve can cost $90 in volume and a characterized restrictor to pressin the air valve and make a flow node from the air valve, can cost anadditional $20.

FIGS. 3A-3B are schematic diagrams illustrating alternativeconfigurations of a valve relative to a characterized restrictor,according to some embodiments.

In more detail, the valve seat and poppet assembly 1301A of a firstconfiguration in FIG. 3A are located upstream of the characterizedrestrictor 1303A. In some cases, the characterized restrictor 1303A canbe exposed to the multiple gases from other flow nodes and MFCsexhausting to a common conduit. In a no flow condition, the isolation onthe flow node is closed, and small amounts of these other gases canbackflow into the restrictor 1303A which can lead to reliability issuessuch as corrosion or particle generation in the case where the gases areincompatible or in reacting families. In an alternative configuration ofFIG. 3B, a characterized restrictor 1303B is located upstream of a valveseat and poppet assembly 1301B. By locating the valve seat and poppetassembly 1301B downstream, the backflow is remediated. On the otherhand, the buildup of gas pressure between the restrictor 1303B and thedownstream valve seat can cause a microburst which may be objectionablein some cases. So long as the ratio of conductance remains, the flownode operates within tolerable error limits.

FIGS. 4A-4C are schematic diagrams illustrating alternativeconfigurations of multiple flow nodes, according to some embodiments.

Specifically, FIG. 4A shows a gas stick 1400A with two flow nodes1401A,B in parallel. An additional K1S substrate 1402 is needed tosupport the additional flow nodes.

In operation, the process gas can flow through either flow node or both.When flow node 1401A is open, the process gas flows to a conduit 1403and when flow node 1401B is open, the process gas flows to a conduit1404. For example, one flow node can be configured to accurately handlelow flows while the other flow node accurately handles all non-lowflows. The dual flow node thus increases an overall dynamic range thatis superior to an MFC. Further efficiency is achieved because a singlepressure transducer is shared between the flow nodes.

While the characterized restrictors are located downstream of the valveseat in the FIG. 4A, FIG. 4B shows an example of characterizedrestrictors located upstream of the valve seat. When a flow node 1413Ais open, the process gas inlets through a conduit 1411, and when a flownode 1413B is open, the process gas inlets through a conduit 1412.

A further example of FIG. 4C shows an embodiment of a gas stick 1400Cwith three flow nodes 1421A-C in a parallel configuration. Thisconfiguration provides the equivalent capability as three separate MFCs,but only occupies one third the space while providing a cost savings.The embodiment also shows characterized restrictor located downstream ofthe valve seat and poppet assemblies, although the oppositeconfiguration is also possible. When the flow node 1421A is open, theprocess gas flows through a conduit 1422, when the flow node 1421B isopen, the process gas flows through a conduit 1423, and when the flownode 1421C is open, the process gas flows through a conduit 1424.

FIGS. 5A-5C are schematic diagrams illustrating a flow node supplied bya self-venting electronic regulator, according to some embodiments.

The proportional dump valve, or optional on/off valve with flow limitingrestrictor in series, allows process gas to be vented from theadditional conduit routed to a vent. By quickly depressurizing theconduit in a low flow scenario, changes in mass flow rate are realizedwith reduced bleed times.

As shown in FIG. 5A, an electronic regulator 1501A includes a valve 1502and optional flow limiting restrictor 1503 in series with a conduit to avent. A feedback and control 1599 can coordinate components. Theconfiguration can relieve a volume of gas between a proportional valve1504 and a flow node 1505 (and coupled to a pressure transducer 1506)allowing it to transition more quickly from a higher pressure set pointto a new lower pressure set point than could occur without the ventingof gas, thus avoiding intolerable slow bleed down.

In an embodiment of FIG. 5B, a proportional valve 1511 provides acontrolled release of the process gas to a conduit 1512 for venting. Inan embodiment of FIG. 5C, an on/off valve 1531 with a limiting flowrestrictor is used release the process gas to a conduit 1532 forventing. The on/off valve 1531 and limiting flow restrictor arepreferred in some cases due to lower cost and less complexity forcontrol.

FIG. 6 is a flow chart illustrating a method for delivering a processgas with a remote pressure measurement, according to an embodiment. Themethod can be implemented by any of the flow nodes discussed above.

At step 1610, pressure points associated with mass flow parameters of aprocess gas are received. For example, an electronic regulator canreceive pressure set points from a controller that is aware ofcharacteristics of the flow node and a temperature and pressure, P2(assumed or measured).

At step 1620, a process gas is received through a high conductance valveand poppet assembly. An actuator changes position to move the poppet,thereby allowing or preventing gas flow.

At step 1630, a primary flow of the process gas is limited by the lowconductance characterized restrictor. As the restrictor is characterizedso that flow is known as a function of pressure to the restrictor, amass flow through the restrictor is known if one knows the pressuredelivered to the flow node. Correspondingly, one can change mass flow toa new desired value by changing the pressure delivered to the flow node.As discussed, a ratio of conductance between the valve seat and thecharacterized restrictor, along with a minimized volume between the two,produces a very low pressure drop allowing the remote pressuremeasurement to represent the pressure at the inlet of the restrictorwith sufficient accuracy to allow sufficiently accurate flowmeasurement.

At step 1640, the process gas is delivered to an exhaust. The processgas can move on to be mixed with other gases, heated, cooled, or thelike.

Section II

As more refined manufacturing processes evolved with time, higherperformance was needed from thermal and pressure based MFCs. Thestability and accuracies of the past devices were bottleneckingsemiconductor fabrication process. Process step durations shortened to 5second steps seen now verses 30 minutes process steps of the past. Therelatively long transient time to change gas flow rates to the processonce acceptable with the longer process steps is problematic with theshorter process steps. Further, MFCs are lagging to meet the demand forcontrolling gas flows over a wider flow range with more accuracy andless costly hardware.

The pressure based MFC was introduced in the last decade and is nowovertaking the use of the thermal MFC in critical etch applications. In2002, Fugasity introduced a pressure base MFC called the Criterion. Thepressure based MFC was an improvement on the thermal MFC and hence was acommercial success. However, those same forces that pushed thedevelopment of the Criterion, the demand for improved performance andreduced price, are still pushing to improve the design of the pressurebased MFC.

One of the issues common to thermal and pressure based MFCs is formfactor. Space is very expensive in a modern semiconductor tool. Theinterface connecting the MFC to the other components in a gas box hasbeen standardized by the industry to allow interchangeability of devicessuch as MFC and air operated shut off valve produce by a multipledifferent suppliers. The dominate interface standard in the industry isbased on components being 1.1″ wide. MFC's are 1.1″ wide (28.6 mm) by4.13″ (105 mm) in length with porting and other geometry details asdescribe in the Semi F82-0304 specification. Similarly a secondinterface specification, Semi F84-0304, defines the interface geometryfor air operated valve as being 1.1″ wide by 1.1″ in length squareinterface.

Independent of the device type or manufacturer the vast majority ofcomponents (air valves, filters, check valves, regulators, etc.) foundin the gas box of a modern semiconductor fabrication tool will complywith the 1.1″ square interface. MFC and Electronic regulators will fitthe 1.1″×4.13″ rectangular interface.

These device interchangeability issues and the resulting interfacestandards have had the impact of preventing spontaneous component sizereductions. About every 10 to 20 years the industry has seen a newsmaller standard proposed and accepted, but in time periods betweenthese adoptions, devices are, as a practical matter, forced to retainthe external envelope defined by the standards.

However, internal device design improvements that allow smaller internalcomponents, while not affecting the external envelope, have had thebeneficial effect of allowing more instrumentation and functionality tobe placed into the standard external envelope. For example a supplypressure transducer, typically a 1.1″ square interface, had beentraditionally place upstream of an MFC. Component size reduction of thepressure transducer and similar reduction in the MFC's internalcomponents has allow the function of the supply pressure transducer tobe integrated into the MFC thus eliminating the need for the 1.1″ squareinterface formerly used by the pressure transducer.

What is needed is a robust MFC having various space-saving layouts thatallows additional component integration within the standard envelope andwhich incorporates improved design, components and new functionalitiesto address the transient response issues and accuracy limitationsinherent in the current devices. Additionally, a layout in an MFC allowsfor a smaller pressure based MFC package size that allow it to fit thesmaller standard square interface envelope rather than requiring thelarger rectangular interface that current MFCs require.

An MFC device, and methods therein, with various space saving layouts isdescribed.

FIG. 7 is a schematic diagram illustrating a layout of a pressure basedMFC 2100 with a P1 pressure transducer 2104 coupled to a base 2110within a standard envelope. The MFC 2100 can be 4.13″ long to fitindustry standards. It consists of a proportional flow control valve2105 at an inlet 2101 of the device, followed by the P1 pressuretransducer 2104 downstream of a proportional flow control valve 2105,followed by a characterized laminar flow element (LFE) 2115 acting as aflow restrictor, and a P2 pressure transducer 2106 near the outlet 2102of the device. The MFC 2100 also utilizes a printed circuit board (PCB)(not shown) containing supporting electronics, software and calibrationcoefficient for receiving, pressure signals, a temperature signal (e.g.,from a temperature sensor 2107 embedded in the device) and an externalset point indicating the target flow. Given these inputs the PCB drivesa voltage to the proportional inlet valve 2105 until sufficient pressurewas achieved in the volume between a poppet of a valve and thedownstream restrictor, to achieve the needed flow through therestrictor. This particular pressurized volume is referred to herein asa P1 volume. Under this paradigm, the P1 pressure transducer 2104 iscoupled to the base in order to monitor the pressure of P1 volume. Gasflow follows arrows in from inlet 2101 through device 2103 to volume2198 through LFE 2115 to volume 2199 and out at outlet 2102.

FIG. 8A is a schematic diagram illustrating a layout for a pressurebased MFC 2200A with a P1 pressure transducer 2210A decoupled from abase 2220, according to an embodiment. Because the P1 pressuretransducer 2210A no longer occupies space on the base 2220, the envelopecan be reduced from the standard size of 4.13″ or the freed up space onthe base can be used to add additional components and functionality.

The inlet 2211 of the MFC 2200A receives a process gas into a conduit(e.g., an inlet conduit). Nitrogen is an exemplary process gas, but anysuitable gas or fluid could be substituted. The conduit can be anysuitable tubing, plumbing or machined block, either rigid or flexible. AKS1 substrate block (not shown) as manufactured by Hytron Corporation,serves as an interconnecting platform for the base 2220 of the MFC 2200Aand other components for supplying gas to and receiving gas from the MFC2200A.

The proportional inlet valve 2230A can be a solenoid or otherappropriate component physically coupled to the base 2220 to control gasflow through an inlet 2211 of the MFC 2200A. Process gas is receivedfrom the conduit (e.g., the inlet conduit) and sent back to the conduitafter processing (e.g., the intermediate conduit). Rather than beingdirectly connected to the base 2220, the P1 pressure transducer 2210 iscommunicatively coupled to monitor process gas internally downstream offrom the valve seat and poppet of proportional inlet valve 2230A. Insome embodiments, the proportional inlet valve 2230A has a movableportion and a fixed portion, and the P1 pressure transducer 2210A iscoupled to the fixed portion.

More specifically, the proportional inlet valve 2230A has a solid upperpole rigidly attached to an outer tube, also rigidly attached to thebase of the valve which is sealed to the base 2220 of the MFC 2200A. Themechanism contains the pressurized gas flowing through the proportionalinlet valve 2230A. Inside the outer tube a movable plunger is suspendedvia a radial spring. A conduit is bored through the fixed pole tocommunicate gas pressure to the P1 pressure transducer 2210A attach toan end of the fixed pole, on top of the proportional inlet valve 2230.As a result, the process gas and its associated pressure can communicatefrom the exits of the valve seat to the P1 pressure transducer 2210Aallowing the P1 pressure upstream of the restrictor to be sensed andcontrolled.

Details 2201 and 2204 are detail views showing the gas passagesconnecting the valve seat to the P1 pressure transducer 2210. Detail2201 shows the small passages that contain gas from the valve seat tothe movable plunger. Detail 2202 illustrates the flow passage in thearea of the movable plunger and orifice valve seat. Detail 2203 showsthe gas passage past the radial spring and into the small annular gapbetween the movable plunger and the lower details of the fixed outertube assembly. Detail 2204 illustrates the annular gap passage betweenthe top section of the fixed outer tube assembly and the movable plungerand a second passage between the gap between the movable plunger and thefixed core where it enters the bore drilled through the length of thefixed plunger.

Although these passages are small, little flow is needed to pressurizeor depressurize the small volume, hence, the pressure measured by the P1pressure transducer 2210 effectively represents the pressure at anoutlet 2212 of the valve seat and the inlet to the characterizedrestrictor.

A P2 pressure transducer 2240 measures process gas in the conduit (e.g.,outlet conduit) between an LFE 2225 and the outlet 2212. The outlet 2212delivers the process gas to a next conduit for eventual use by theprocess. In some embodiments, additional processing is performed on theprocess gas, such as mixing with other gases, or the like. A temperaturesensor 2245 provides temperature readings and a PCB 2235 processes thetemperature readings and other information in controlling the componentson the MFC 2200A.

In an embodiment of an IGS style MFC, due to arranging the P1 pressuretransducer on top, the MFC functionality can be provided by a smallerenvelope (e.g., see FIGS. 14 and 15). In more detail, rather thancomplying with the traditional interface standard of Semi F82-0304 for arectangular-shaped interface having a 4.13″ long base, the IGS style MFCcan comply with the Semi F84-0304 standard for a square-shaped interfacehaving a 1.1″ base. Both standards are hereby incorporated by referencein their entirety.

FIG. 8B is a schematic diagram illustrating a layout for a pressurebased MFC 2200B with a P1 pressure transducer 2210B decoupled from thebase over proportional inlet valve 2230B and an additional componentcoupled to the base within a standard envelope, according to anembodiment.

Relative to FIG. 8A, the newly available real estate along the base ofMFC 2200B is utilized for integrating one or more additional components2270 within the standard size envelope rather than reducing the envelope(e.g., see FIGS. 9-13 for examples of additional components).

FIG. 9 is a schematic diagram illustrating a layout for a pressure basedMFC 2300 with a P1 pressure transducer 2310 decoupled from the base anda relief valve 2370 coupled to the base within a standard envelope,according to an embodiment. Space for the relief valve 2370 is enabledby the relocation of the P1 pressure transducer.

For MFCs having a small flow range, 500 sccm and below for example, thepressurized mass of gas between the valve seat of the proportional inletvalve and the inlet of the flow restrictor, the P1 volume, issignificant compared to the desired flow rate to the process.Traditionally, when one gives the MFC a command to stop flow, viaoutputting a set point value of zero, the inlet proportional valvecloses immediately but flow continues to bleed through the restrictorand to the process as the pressure in the P1 volume bleeds down toequalize with the pressure downstream of the restrictor. In the currentpressure based MFC 2300, the mass at P1 pressures that correspond to100% full scale flow is roughly 1 to 2 standard cubic centimeters (i.e.,1 scc=1 cc of gas at 0 C and 1 atm). If the MFC is relatively large, say1000 sccm at full scale, FS, (i.e., 1000 scc per minute) then the massin the P1 volume is insignificant compared to the working flow rate andit bleeds off relatively quickly. However, flow rates below 1 sccm arenow being requested. If the MFC is a 1 sccm FS device the P1 mass isvery significant and the time constant of bleeding off the P1 mass is 1minute. If the process is 5 seconds in length, then having an MFC thatcontinues to flow gas to the process minutes after the command to stopflow, is not an acceptable situation. As a practical matter, thetraditional mechanical full scale of pressure based MFC are limited tobe above 250 sccm, to avoid this issue. Pressure based MFCs, which arebuilt and labeled with full scales below this value, typically have thelarge 250 sccm laminar flow element restrictor but operate in the lowerrange operation by electronically or numerically scaling the flowcalculation so that although the device is mechanically large its fullscale reading is much smaller. The larger restrictor lowers the P1pressure and bleeds down the P1 volume quicker, however this methodinduces larger device calibration drift.

The relief valve 2370 of FIG. 9, by contrast, routes the P1 volume massto a non-process abatements system via a vent or vacuum pump (also seeFIGS. 10, 12, 13 and 15). In operation, a PCB controls a proportionalvalve controlled by a PCB. When it is desired to reduce the flow fromthe MFC 2300 faster than the natural bleed down time constant of thebleed off through the restrictor to the process, the proportional P1relief valve will open and control the P1 pressure to a lesser pressure.The lesser pressure can be controlled to quickly reduce to a lower flowrate or to stop flow. In the IGS 2900 of FIG. 15, an orifice 2910replaces the proportional valve for cost and space savings. The orifice2910 is sized to bleed off a mass flow rate typically between 50 and 500sccm (give a 1 cc P1 volume) to allow the speedy depressurization,relative to the intended process time, of the P1 area. It is noted thatan on/off valve might be placed downstream and in series with the ventline if it is desired to reduce the quantity of gas vented. In this casecontinuous venting is avoided and gas is only vented when it is desiredto reduce the P1 pressure.

FIG. 10 is a schematic diagram illustrating a layout for a pressurebased MFC 2400 with a P2 pressure transducer 2440 decoupled from thebase and located remote to the envelope, and a relief valve 2470 coupledto the base, according to an embodiment.

The gas box of a modern semiconductor fabrication tool controls andmixes the flows of multiple gas species. Typically these gases combineat a common header connected to the exhaust of each of different gassticks contain the different MFCs. Although there is typically a shutoff air valve at the end of each MFC, its conductance is sufficientlyhigh compared to the flow rate of the MFC that the pressure of thecommon header is sufficiently indicative of the P2 pressure seen by theindividual MFCs when the shut off air valve is open and gas is flowingfrom the MFC. As a result, the P2 pressure information from a singlepressure transducer located on this exhaust header (via analog ordigital connections) can be shared with the PCBs of the individual MFCsto provide the P2 pressure information without the need for individualP2 pressure transducers located on each MFC. Optionally the P2information may be read by the tool controller and sent electronicallyto the MFCs. In this layout, space is gained by removing the secondpressure transducer allowing a smaller envelope or additional integratedcomponents. Moreover, cost savings is realized because P2 pressuretransducers are not needed on each MFC.

In one embodiment, as shown by FIGS. 14 and 15, the P2 pressuretransducer 2840, 2940 can be located remotely to an IGS style MFC 2800,2900. In other embodiments, the P1 pressure transducer 2810, 2910 can beplaced on top of the proportional inlet valve as described herein.Furthermore, other embodiments can add a second LFE or a self-relievingvalve.

FIG. 11 is a schematic diagram illustrating a layout for a pressurebased MFC 2500 with a P1 pressure transducer 2510 decoupled from thebase and a second LFE 2525B, according to an embodiment. In FIG. 13, theMFC with a P1 pressure transducer 2710 decoupled from the base and asecond LFE 2725B also has a remotely-located P2 pressure transducer2740.

Returning to FIG. 11, the second LFE 2525B is configured in series witha high conductance valve 2575. The high conductance valve 2575 for thisembodiment can be characterized by a pressure drop through the valvesufficiently small compared to a pressure drop across the second LFE2225B, such that the flow calculation error induced by ignoring thevalve pressure drop is acceptably small. For example, ignoring thepressure drop a standard ¾″ valve used in the industry in series with aLFE typically induces a 0.15% R error at 5,000 sccm flow of N2. It isnoted that this error can be further reduced, or flow rates increasedwithout loss of accuracy, by numerically correcting the flow calculationbased on the characterization of the valve used.

This additional LFE 2525B and valve are placed in parallel with theinitial LFE 2525A. When the high conductance valve is closed the MFC2500 has the full scale of the single initial LFE. When the highconductance valve is open, the MFC 2500 has the full scale of the twoLFEs 2525A, 2525B in parallel. By making the added LFE 2525B markedlylarger (i.e., much more flow at the same P1 and P2 pressures) than theinitial LFE 2525A, the MFC 2500 will have a markedly higher full scaleflow capability. Effectively, the MFC 2500 has the novel aspect ofoperating as a high flow and a low flow MFC that shares the same inletvalve, transducers and PCB in the same package size as other MFCs. TheMFC 2500 allows the replacement of multiple gas lines and MFCs for asingle gas species, a situation commonly seen in a modern gas box, by asingle gas line and MFC saving both space and cost.

The present MFC 2500 meets dueling industry demands for accurate flowcontrol and wider ranges than current MFCs can support. The O2 flowrates from 0.1 sccm to 10,000 sccm are now achievable on the same tool.In other devices, separate O2 MFCs of different full scale values areconfigured to cover the desired flow range at the intended accuracy. Theadditional LFE 2525B with the high conductance on/off valve in seriescan cut the number of O2 (or other gas) MFCs in half, saving space andmoney. While the initial LFE 2525A of the pressure based MFC 2500 canmaintain 1% reading accuracy over a dynamic range of 20 to 1, the dualLFE operation of the MFC 2500, with the proper ratio between the LFE's2525A, 2525B, can maintain a 1% of reading accuracy over a dynamic rangeof 20×20 to 1 or 2400 to 1. One of ordinary skill in the art willrecognize that a dynamic range of 20 to 1 and a reading accuracy of 1%are just examples that can be varied for different implementations.

Optionally, the two LFEs 2525A, 2525B may be sized to focus on separateflow ranges that are not adjacent but that are further apart. Forexample, the smaller restrictor controlling flow accurately from 0.5sccm to 10 sccm and the larger LFE sized to control flows from 200 sccmto 4000 when the high.

In other embodiments a third or more LFEs can be added for additionalrange.

In the layout embodiment of FIG. 12, a pressure based MFC 2600 with asecond LFE 2625B (in addition to a first LFE 2625A) also includes a P1pressure transducer 2610 decoupled from the base, and a relief valve.Additionally, in the layout embodiment of FIG. 13, a pressure based MFC2700 with a second LFE 2725B (in addition to a first LFE 2725A) with aP1 pressure transducer decoupled and a relief also includes a P2pressure transducer decoupled from the base and located remote to theenvelope. As described above, the P2 pressure transducer can be locatedownstream, for example, at a common exhaust header shared by severalMFCs.

Section III

MFCs and electronic regulators are important components of deliveringprocess gasses (e.g., N2, O2, SF6, C4F8 . . . etc.) for semiconductorfabrication. Of particular interest are the atomic layer deposition(ALD) and three-dimensional integrated circuit (3DIC) processes whichrequire the rapid and repeated changing or the gas species in theprocess chamber thousands of times to achieve the needed feature.

Changing the gas species in the chamber requires the interruption of theflow on one gas species and beginning the flow of a second gas species.One alternately turns on a Gas A and off a Gas B, and then turns off GasB and turns on Gas A again. MFCs are normally used to turn on, turn off,and control process gas flows, however commercially available MFCs areslow to turn on and achieve controlled flow, typically having responsetimes between 0.3 and 1.0 seconds, thereby creating a bottleneck insemiconductor processing, particularly for ADL and 3DIC processing.

Other techniques mitigate the processing bottleneck by using an MFCoperating at a steady state and flowing into an on-off valve that opensand closes more rapidly (e.g., every 10 to 50 msec). With this approach,pressure builds up behind the on-off valve when closed during an offcycle because of the MFC continuously flows into an accumulation volumebetween the MFC and the on-off valve. Unfortunately, as shown in FIG.16, when the on-off valve is opened at the beginning of an on cycle, thebuilt up pressure in the accumulation volume initially causes a largeflow of gas that quickly decays in magnitude to the steady state flow ofthe MFC as the stored pressure and mass is released, due to a small timeconstant from a low flow resistance (or nearly no flow resistance) inthe on-off valve.

FIG. 16 shows a graph 100 of test data collected using specialinstrumentation to show an output wave produced by a system using anembodiment of the current method. During normal processing ofsemiconductors, instrumentation to observe the output wave in notavailable and thus actual flow profiles are unseen and often unknown.Problematically, a large, initial spike 120 is produced at the beginningof an on cycle. Due to the pressure build up when the on-off valve isclosed, and high conductance of the on-off valve when opened, theprocess gas rushes through quickly in a ramp up 110 before peaking andthen settling to a steady-state flow level 130 as desired. The magnituderamps down 140 when the on-off valve is again closed during the offcycle.

The initial spike 120, however, is undesirable because it introduces anunseen, unintended, and uncontrolled event. This event can vary fromsystem to system depending on the specific of the plumbing, air valvesand supply pressure actuating the on-off valve (assuming the on-offvalve is an air operated valve), and introduces a random elementintroducing variation in a process in which repeatability is desired. Inaddition, the presence of this large transient gas flow has been largelyunknown and generally, large overshoots in gas flow are undesirable.

Therefore, what is needed is a technique in gas delivery systems toovercome the above shortcomings by repeatable outputting fast squarewaves of flow, which is reproducible from system to system, whileminimizing an initial spike.

Discussed below is a gas delivery apparatus, and methods, to output aprocess gas as rapid square waves by increasing a time constant of a gasflowing to a process during an on cycle, by installing flow restrictorhaving a specific high impedance.

Square Wave Output Characteristics of a Gas Delivery System

FIG. 17A is a graph 3200 illustrating the results of a computersimulation showing a series of square output waves produced by a gasdelivery system with a properly sized and installed flow restrictor, inaccordance with an embodiment of the present invention. Given the gaspressures used and the conductance of the on-off valves typically usedwith the current method, the addition of a flow restrictor can increasesthe flow impedance and hence the a time constant of the flow out of theon-off valve up to, for example, 60,000 times. The resulting squarewaves (such as square wave 3210) are characterized by an on cycle at adesired magnitude of flow (and only minor decay which is affected by thesizing of the restrictor impedance for process gas flow), and an offcycle at a zero magnitude. During the on cycle, the magnitude ramps upover a leading edge, outputs at the desired magnitude duringsteady-state flow, and then ramps down to the zero magnitude over atrailing edge. During the off cycle, the magnitude preferably remains atzero.

Output waves are referred to as square waves, as an ideal, because of adesired consistent, steady-state magnitude during an on cycle. Inimplementation, the output waves are only substantially square orquasi-square waves because of limitations from physical characteristicsof the system. Specifically, decay while outputting at the desiredmagnitude is referred to as droop and results from a time constant ofthe system as configured, as discussed below. An increased pressure, andhence accumulation mass, maintained in an accumulation volume during theon cycle, due to the increased flow impendence by adding the restrictor,keeps the output magnitude more consistent than the original rapidlydecreasing pressure due to the low flow impendence. Relative to theoutput wave 3110 of FIG. 16, the undesirable spike at ramp up beeneliminated due to the drastically increased time constant designed frominstallation of a flow restrictor. Accordingly, during the on cycle,flow from an accumulation volume is relatively constant.

FIG. 17B is a graph 3250 of square output waves produced by a gasdelivery system with a property sized and installed flow restrictor, andan increased accumulation volume, 5 times the value of FIG. 17A, inaccordance with an embodiment of the present invention. The square waves(such as wave 3260) possess the same advantage as the square waves ofFIG. 17A in eliminating the large spike at ramp up. The droop, however,in the MFC embodiment is less prominent because the increasedaccumulation volume further increases the time constant relative to FIG.17A.

Methods for producing the improved fast square waves, and hardware forproducing such square waves, are discussed below.

Methods for Square Wave Output of Gas Delivery

FIG. 18 is a flow chart illustrating a method 3300 for producing squarewaves in a gas delivery system, according to an embodiment of thepresent invention.

At step 3310, a flow restrictor is sized and installed in a throat of anon-off valve. A proper size primarily depends on the available supplypressure, a desired output flow (e.g., a maximum flow target), and aratio of the on-cycle time to the total on-cycle and off-cycle time, andthe desired time constant (which determines droop). For instance, thelower the selected flow coefficient, i.e. higher flow impendence, of aflow restrictor, the higher the resulting pressure drop across thecombination of the on-off valve and the flow restrictor. Therelationship of time constant to wave shape is described in associationwith FIGS. 19A-D.

During an off cycle at step 3320, the on-off valve is closed, so theprocess gas builds pressure in an accumulation volume of conduit locatedupstream from a wave generation component. For example, an MFC in thewave generation component can deliver a continuous predefined mass flowto the accumulation volume, or an electronic regulator in the wavegeneration component can pressurize the accumulation volume, based onset points calculated by processors. As a result, pressure builds in theaccumulation volume until the on-off valve opens.

During an on cycle at step 3330, the on-off valve is opened, allowingthe process gas to pass through a throat of the on-off valve, throughthe flow restrictor. Because the on-off valve essentially has nearlyinfinite impedance when closed and nearly zero impedance when open, gasdelivery is unregulated at this point, leading to a spike if arestrictor of markedly higher impedance has not been placed in serieswith the on-off valve.

However, under the present technique, the flow restrictor ischaracterized with a significantly higher impedance, relative to theon-off valve, to further regulate gas flow. In some embodiments, theimpedance is selected to drastically increase a time constant during aspecific duration of the on cycle by decreasing a flow capacity on theorder of, for example, 60,000 times or more while still delivering gasat an appropriate magnitude of flow, as described more fully below.

At step 3340, process gas is output from the gas delivery apparatus as aseries of (quasi) square waves responsive to opening and closing of theon-off valve.

FIGS. 19A-D are graphs illustrating time constant decay for a linear gasdelivery system, according to one embodiment of the present invention.One of ordinary skill in the art will understand, given the disclosureherein, application of the same principles to a non-linear gas deliverysystem.

In FIG. 19A, a time constant is defined as the amount of time requiredfor an initial variable (pressure or mass flow) to decay by 63.2% inroute to steady state flow at 0%. The time constant is a defined as:Tc=(V*DP)/m, where V is an accumulation volume, DP is a total variabledrop (pressure or mass flow) between an initial time and infinity, and mis the initial mass flow rate (or pressure drop rate) out of theaccumulation volume. Therefore, the time constant is a function of theinitial mass flow rate which is drastically reduced by a flow restrictorto drastically increase the time constant. Furthermore, the timeconstant is also a function of accumulation volume and can be increasedto further raise the time constant. Accumulation volume, however, islimited to the available space for the device and, as such, cannot beviably increased to have the same order of affect as the flow restrictorimpedance.

In contrast to FIG. 19A, in FIG. 19B, a 20% flow into the volume issuperimposed on the decay as described in FIG. 19A which results in a20% flow at steady state flow after several time constants have passed.

In FIG. 19C, the decay of FIG. 19B to 20% flow is shown over a largespan of time constants for a 1 second on cycle. From this perspective,the decay to steady state resembles the system of FIG. 16, with a largespike 3421 at ramp up before reaching steady state. In other words, atime decay of the spike is small relative to an on cycle. On the otherhand, FIG. 19D shows a time decay that is large relative to the same 1second on cycle. Fewer time constants elapse in FIG. 19D than 19C overthe same amount of time, so the spike 3421 is reduced to a modest droop3431. The period of interest for the on cycle of a square wave accordingto FIG. 19D ends before significant pressure decay from the large timeconstant. The pressure decay from the smaller time constant of FIG. 19Cis undesirable.

Accordingly, a flow restrictor is introduced to a gas delivery systemmarkedly increases the decay time in order to bring droop, during an oncycle, within tolerance of a specific semiconductor process.

Systems for Gas Delivery a Square Wave Output

FIG. 20 is a high-level schematic diagram conceptually illustrating asystem 3500 to produce a square wave using an MFC, according to oneembodiment of the present invention.

A wave generation system or component includes an MFC 3501 coupled to anon-off valve 3504 within component 3503. An accumulation volume 3502 isshown conceptually as an aggregate of volume between the MFC 3501 andthe on-off valve 3504. For instance, conduit volume, spacing withincomponents, and even additional accumulation chambers can all add to atotal accumulation volume.

The on-off valve 3504 can be air actuated to move up and down to openand close during on and off cycles, respectively. When the on-off valve3504 moves up to open, process gas in the conduit is markedlyunrestricted by the open valve seat of the on off valve but is primarilyrestricted by flow restrictor 3505. The flow restrictor 3505 is sizedand installed in a throat of an on-off valve seat 3506. The restrictor3505 can be selected so that the flow impendence provides a predefinedamount of restriction to gas flow from the accumulation volume 3502.Sizing can refer to a size of an opening, porosity of a sintered media,or diameter of a long capillary tube. In some embodiments, a flow nodeis implemented in component 3503, as shown in FIG. 21.

FIG. 21 is a schematic diagram illustrating a system 3600 to produce asquare wave optionally using a flow node, according to one embodiment ofthe present invention. In general, a flow node can be used along with apressure reading from the electronic regulator 3601 to measure pressureat the inlet of the restrictor, even if the restrictor is downstream ofthe valve seat of the on-off valve, because the flow resistance isnegligible between the on-off valve seat in component 3603 and theupstream electronic regulator 3601. In alternative embodiments,electronic regulator 3601 is replaced with a proportional valveoperating in conjunction with a pressure transducer coupled toaccumulation volume 3602. Note that the downstream pressure transducer3620 may be needed for laminar and molecular flow restrictors buttypically is not needed when using a sonic flow restrictor.

The space consumption and cost of a second local pressure transducer onthe accumulation volume is not needed to know the pressure at the inletto the restrictor. It is needed when using only a proportional valve butnot with the e-reg present. A temperature sensor 3606 (located withincomponent 3603) detects temperature (e.g., a flow restrictor and/ortemperature of the process gas) and allows for accommodation oftemperature measurement typically used in a massflow calculationutilizing pressure based methods. A PCB 3610 includes electronics tocalculate flow and to adjust operation of the electronic regulator 3601(or other device) based on feedbacks from the temperature sensor andpressure sensor(s) 3606, and the optional downstream pressure transducer3620.

FIG. 22 is a schematic diagram illustrating a system to produce a squarewave of a gas mixture, according to one embodiment of the presentinvention. A first MFC 3701A and a second MFC 3702A are both connectedto an accumulation volume 3702 feeding component 3703. A PCB 3710controls the first and second MFCs 3701A,B. In one example, the firstMFC 3701A feeds oxygen at a mass flow rate while the second MFC 3701Bfeeds nitrogen. The relative concentration of the two gases can beadjusted by controlling the relative set point sent to MFCs 3701A to3701B by the PCB 3710.

FIG. 23 is a more detailed schematic diagram illustrating an examplesystem 3800 to produce a square wave, according to one embodiment of thepresent invention.

The system 3800 includes an electronic regulator 3810 coupled by a firstconduit section 3801 to a gas supply and coupled to a second conduitsection 3802. A local pressure transducer, at the top of 3810, trackspressure in the second conduit section 3802.

A relief valve 3820 is coupled to the second conduit portion 3802 and athird conduit portion 3803 and a fourth conduit portion 3804. The reliefvale 3820 is an optional implementation for faster bleed off from anaccumulation volume. Depending on the desired flow rate for the specificprocess, required output pressure in 3804 can vary widely, and theconduit portion 3803 can be activated to quickly send extra mass to avacuum. When not needed, the relief valve 3820 can remain in a closedposition.

An accumulation chamber 3830 is coupled to the fourth conduit portion3804. The accumulation chamber 3830 adds to a total accumulation volumefor improved performance, as described above. For example, theaccumulation chamber 3830 can add 40 cc to an existing 4 cc that mightbe typical of the volume between the valve seats of 3810 and 3840. Timeconstant is a function of accumulation volume, albeit to a much lesserextent than time constant is a function of the impendence of the flowrestrictor (which determines the pressure in the accumulation volume).For example, the square waves of FIG. 17B display approximately ⅕th thedrop of the square waves of FIG. 17A, due to a fivefold increase inaccumulation volume from 20 cc in FIG. 17A to 100 cc in FIG. 17B. Thus,additional accumulation volume can further increase a time constant asneeded.

An on-off valve 3840 is coupled to the fourth conduit portion 3804 andto a fifth conduit portion 3805 that exhausts through a flow restrictor3815 to the process and a downstream pressure transducer 3850, asdescribed herein. In other embodiments, the flow restrictor 3815 islocated upstream from the on-off valve 3840.

A PCB 3860 is electronically coupled to one or more of the electronicregulator 3810, the relief valve 3820, the on-off valve 3840, atemperature sensor 3845 and the downstream pressure transducer 3850.Note that the downstream pressure transducer 3850 may be needed forlaminar and molecular flow restrictors but typically is not needed whenusing sonic restrictor.

FIG. 24 shows a graph 3910 with a series of square output waves producedby a gas delivery system with an electronic regulator while graph 3920,whereas graph 3950 shows a series of square output waves produced by agas delivery system with an MFC. As can be seen, an electronic regulatorreaches a steady-state of output characteristics almost immediatelywhile the MFC does not. Once the MFC reaches steady-state, theperformance is similar. Some implementations may not have tolerance forthe ramp up time of an MFC.

In some embodiments, a higher set point is initially given to an MFC sothat pressure in the accumulation volume can reach steady-state morequickly. Once at steady-state, the set points are reduced to what isnecessary to maintain the desired steady-state flow. The higher setpoints can be used for a predetermined amount of time, or alternatively,responsive to a pressure transducer coupled to measure pressure in theaccumulation volume.

Section IV

The MFC typically functions as a subsystem within a larger capitalequipment apparatus referred to as a tool. However, commerciallyavailable pressure based MFCs are slow to transition between gases or totransition from higher to lower flow rates of a single gas, particularlyfor lower full scale flow rated devices, because of space withinconduits of MFCs that are depressurized during transitions (also knownas an accumulation volume). Typical response times can be between 0.2and 4.0 seconds. Response times longer than 4.0 seconds are typicallynot allowed on many applications as monitoring systems on some equipmentalarm at 4 seconds. The smaller the device's full scale rating theslower the depressurization response time. The 4 second limit currentlyexcludes devices with full scale flow rating 100 SCCM (standard cubiccentimeter per minute) or below. This slow response either creates abottleneck in semiconductor processing, particularly for ALD and 3D-ICprocessing and/or forces poorer accuracies on flow rates below 50 SCCMas larger full scale devices are used to avoid unacceptable responsetimes. Other techniques such as natural bleed off are slower thandesired. Additionally, downstream purging or diverting techniques canrequire undesirable hardware modifications or additions.

Of particular interest are the accumulation volumes in pressure basedMFCs and flow measurement systems that delivery process gas at low flowrates. With smaller mass flows, the depressurization process of theaccumulated volumes can slow down the transition of the MFC to anintolerable amount of time.

Therefore, what is needed is a robust technique in gas deliveryapparatus to overcome the above shortcomings by evacuating process gasin an accumulation volume upstream of a characterized flow resistance toa non-process location.

Gas delivery apparatus, gas delivery methods, non-transitorycomputer-readable media with source code, for reversing gas flow from anaccumulation volume for pressure regulation with fast pressure bleeddown, are disclosed. One of ordinary skill in the art will recognize,given the below description, variations available to one of ordinaryskill in the art, such as the application of these principles to fluid,or a mix of gasses and fluid, in an accumulation volume.

Fine chemical synthesis, pharmaceutical production, optical fiberprocessing, nano material manufacturing, and similar high purity fluiddelivery applications will also benefit from the disclosed techniques.General industrial applications can also benefit where a single devicecan act as both a standard forward pressure regulator and a backpressure regulator thereby replacing the need for extra hardware andproviding a cost reduction.

I. Gas Delivery Apparatus using Both Forward and Reverse Flow Mode forPressure Regulation of an Accumulation Volume

FIG. 25 is a perspective diagram illustrating a gas delivery apparatus5100 utilizing a reverse flow mode for fast bleed down of anaccumulation volume 5199, according to one embodiment. The gas deliveryapparatus 5100 can be, for example, an MFC, a flow node and associatedhardware, or the like. In one example, a low flow MFC delivers oxygen ornitrogen to a semiconductor fabrication process in a clean room. A flowpath of the gas delivery apparatus 5100 includes a conduit inlet 5105receiving downstream to conduits 5115A-D, accordingly, and exhaustingdownstream to a process at a conduit outlet 5125. A preferred embodimentof the gas delivery apparatus 5100 involves low flow gas delivery whichcan be characterized as less than 5100 SCCM (standard cubic centimetersper minute) or approximately 4/1000 chemical mole per minute. Althoughgas is referred to throughout the description for simplicity, someembodiments handle liquid or a dynamic mixture of gas and liquid (e.g.,droplets). Some embodiments comprise more than one characterizedrestrictor for wider dynamic accuracy (e.g., in a parallelconfiguration).

An accumulated (accumulation) volume includes at least a portion ofspace within the conduit 5115C between a proportional valve 5120 and acharacterized restrictor 5130. A pressure transducer 5121A measures anassociated pressure (i.e., pressure P1 in volume V1). Some embodimentsalso include space within the conduit 5115B upstream of the proportionalvalve 5120. Spacing within and between components can also be included.FIGS. 28A and 28B show an abstraction of the gas delivery apparatus 5100including the accumulated volume 5199 (P1 volume). However, space withinthe upstream conduit 5115A and the downstream conduit 5115D can beeffectively separated from the accumulated volume 5199 and considered asa second accumulated volume and have a different pressure as measured bya second pressure transducer 5121B (i.e., volume V2 held at pressureP2). A second downstream cycle purge valve 5106 can be used to regulatepressure within the second accumulated volume of conduit 5115D. In somecases, the second accumulated volume does affect pressurization of thefirst accumulated volume 5199. The conduits 5115A-D can be any suitabletubing or plumbing, either rigid or flexible, to deliver gas (or fluid)to the next stage. The conduits 5115A-D can have a diameter of, forexample, ¼ inch.

An electronic regulator (or electronic pressure regulator) 5110communicatively couples to a valve system and the proportional valve5120. Based on inputs of set points and sensor feedback (e.g., frompressure transducer 5121A), commands are sent from the electronicregulator 5110 to the valve system to open or close valves. Alsocommands can be sent to the proportional valve 5120 which can furtheropen, further close, or stop adjustments. When sensor feedback indicatesthat the accumulated volume pressure is too low, a forward flow mode isimplemented to intake a mass of the process gas with a downstream flow(e.g., by opening the proportional valve 5120). When sensor feedbackindicates that the accumulated volume pressure is near a target range, ahalt or rate reduction is implemented (e.g., by stopping or slowing downadjustments of the proportional valve 5120). Finally, when sensorfeedback indicates that the accumulated volume pressure is too high,some embodiments implement a reverse flow mode to evacuate a mass of theprocess gas (e.g., by closing the gas supply shut-off valve 5102,opening the upstream cycle purge valve 5104, and controlling theproportional valve 5120). In some embodiments, a control system of theelectronic regulator 5110 may function in the forward flow mode as astandard pressure reducing regulator and may function in the reverseflow mode as a back pressure regulator. In both instances the electronicregulator 5110 will actively adjust and control the pressure in theaccumulated volume 5199 according to inputs of set points and sensorfeedback.

The electronic regulator 5110 can switch modes periodically or in nearreal-time responsive to changing inputs. In some implementations, theelectronic regulator 5110 may switch control strategy responsive to moreinputs than just pressure. For example, a flow command below a thresholdcan require a relatively large accumulation volume pressure drop, or apressure drop in a short amount of time (i.e., short bleed down time),accomplished by resorting to the reverse flow mode. In such a situationthe electronic regulator 5110 may close the gas supply shut-off valve5102, open the upstream cycle purge valve 5104, and set the proportionalvalve 5120 to a fully open condition (not subject to customary PIDcontrol) to quickly achieve a desired large pressure drop. Anotherexample involves switching from one type of gas to another in which theentire accumulated volume is bled. Still another embodiment factors intemperature feedback from sensors for additional control functions. Amore detailed view of the electronic regulator 5110 is set forth belowwith respect to FIGS. 26-27.

The valve system of FIGS. 25, 28A and 28B may be controlled by acontroller of the electronic regulator 5110 to implement the forward andreverse flow modes, as shown in FIGS. 28A and 28B. In the forward flowmode of FIG. 28A, a gas supply valve 5102 can be opened and a purgevalve 5104 closed. This arrangement allows pressure to build up behindthe proportional valve 5120 upstream for pressurizing the accumulationvolume 5199 as the proportional valve 5120 is further opened. However,in the reverse flow mode of FIG. 28B, the gas supply valve 5102 can beclosed and the purge (or dump) valve 5104 opened. This depressurizesspace in the conduit 5115B held behind the proportional valve 5120notionally upstream of the accumulated volume. As the proportional valve5120 further opens, reverse flow from the accumulated volume transitsinto the open purge valve 5104 which evacuates gas to a non-processlocation using a vacuum pump. Additional valves are possible (e.g.,outlet valve 5108). Alternatively, the semiconductor capital equipmenttool (not shown), within which the gas delivery apparatus 5100 isinstalled, may control the configuration of the supply valve 5102 andthe purge valve 5104 while adjusting set point commands to theelectronic regulator 5110 and thereby directing suitable control of theproportional valve 5120 to implement the forward and reverse flow modes.

The proportional valve 5120, responsive to the electronic regulator5110, may function as the primary adjustable control element in both theforward and reverse flow modes. To enable control of flow in both theforward and reverse flow modes the proportional valve 5120 is locatedwithin a conduit upstream of the accumulated volume 5199 and downstreamfrom both the gas supply line valve 5102 that supplies the process gasand the purge line valve 5104 that evacuates process gas.

A characterized restrictor 5130 impedes (or resists) the process gasfrom exhausting in accordance with component sizing. Specific impedancecharacteristics are designed by sizing components therein. In oneembodiment, the accumulated volume exists in a space downstream of theproportional valve 5120 and upstream of the characterized restrictor5130. In other words, the characterized restrictor 5130 can effectivelyseparate the accumulated volume from an exhaust pathway. Anotherembodiment includes the space upstream of the proportional valve 5120.Generally, various aggregates of conduit space and/or spacing withincomponents can contribute to the accumulated volume. As the accumulationvolume pressurizes or depressurizes, a resulting mass flow rateincreases and decreases. In an embodiment, the characterized restrictor5130 further comprises a valve seat and poppet or other valve and seatmechanisms.

FIG. 26-27 are block diagrams illustrating a view of an electronicregulator of a gas delivery apparatus, according to an embodiment. Theelectronic regulator 5110 comprises a communication interface 5210, aproportional valve controller 5220, a processor 5230 and a memory 5240.

The communication interface 5210 receives data used for determination offorward and reverse flow modes, and sends data for adjustment of theproportional valve 5120. The received data can include external setpoints that define a desired mass flow rate for delivery of the processgas to the semiconductor process. Additional received data can bepressure sensor and/or temperature sensor feedbacks. Other embodimentsof the communication interface 5210 involve sending and receiving datathat is only peripherally related to determination of forward andreverse flow modes, as well as unrelated data.

The communication interface 5210 comprises hardware and/or software.Hardware can be male or female connections for inputs and/or outputs,such as a serial port, a parallel port, a USB port, a FireWire port, anIEEE 802.11 Wi-Fi radio, an Ethernet port, a Bluetooth radio, a radiojack, radios, or any other appropriate port capable of electrical orelectro-magnetic signaling. The software can include networkcommunication modules, operation systems, applications, daemons, coders,decoders, memory, source code, and any other appropriate aspects ofcommunication, stored on a non-tangible computer readable media

For example, detail 5290 illustrates a schematic of various ports usedfor communication in an embodiment. An R45 jack 5292 provides anEthernet receptacle for connecting to an enterprise network for remotelysending external set points from a controller computer. A signaling port5294 connects to a proportional valve for sending control signals forfurther opening, further closing, and stop, for instance. Anothersignaling port 5296 receives pressure and/or temperature sensorfeedback. Other ports are available for other types of connections, suchas a direct connection from an administrator.

The proportional valve controller 5220, responsive to the external setpoints, may determine whether to operate in a forward mode or a reversemode for meeting a target pressure in an accumulated volume, and performalgorithms for PID valve control and flow calculations based in partupon existing sensed conditions. In forward mode the process gas flowsin a usual downstream direction through an electronic regulator into anaccumulated volume. In reverse mode the process gas flows in an unusuallocally upstream direction through the electronic regulator out of theaccumulated volume.

The processor 5230 can be, without limitation, a microprocessor, acustomized ASIC, or any appropriate mechanism for executing source code,in accordance with embodiments described herein. For example, theprocessor 5230 can detect when a threshold has been exceeded leading tothe reverse flow mode. Also, the processor 5230 can map specificcommands from external set points.

The memory 5240 can be, without limitation, RAM, ROM, cache, virtualizedmemory, queues, instruction stacks, flash memory, or any appropriatehardware and/or software for storing source code, values, and the like,in accordance with embodiments described herein.

II. Methods for using Reverse Flow Mode for Pressure Regulation of anAccumulated Volume

FIG. 29 is a flowchart diagram illustrating a method 5400 for utilizinga reverse flow mode for fast bleed down of an accumulated volume,according to an embodiment of the present invention. In one case, themethod 5400 is implemented in the electronic regulator 5110 of thesystem 5100 of FIG. 25, and in other cases, is implemented inalternative systems. Further, the order of steps can be interchanged,and there can be more or less steps than shown in implementations.

External set points that define a desired mass flow rate for delivery ofprocess gas are received (step 5410). Pressure readings are receivedfrom a pressure transducer within an accumulated volume (e.g.,periodically or on demand) (step 5420). Other sensor feedback caninclude temperature readings. Next, it is determined whether to operatea proportional valve in forward mode or reverse mode based on the setpoints and sensor feedback (step 5430). In turn, commands are sent tothe proportional valve for pressurizing or depressurizing theaccumulated volume in accordance with the set points and currentpressure readings (step 5440).

FIG. 30 is a more detailed flowchart diagram illustrating a step 5430 oftransitioning from a forward flow mode to a reverse flow mode, accordingto an embodiment of the present invention. The step 5430 can beimplemented, without limitation, in the proportional valve controller5220 of the electronic regulator 5110 of FIG. 26.

A valve system initially operates in forward flow mode (step 5510).Based on pressure readings received from a pressure transducer, it isdetermined whether the pressure reading is greater than a targetpressure (step 5520). If the pressure is greater, the valve system isadjusted to operate in reverse flow mode (step 5530). If the pressure isnot greater, an opening of the proportional valve can optionally beadjusted as needed (e.g., further opened, further closed, or halted)(step 5525).

If the pressure reading is less than the target pressure while operatingin a reverse flow mode (step 5540), and the process continues (step5550), the valve system is adjusted to operate in the forward flow mode(step 5510). On the other hand, if the pressure is not less than thetarget pressure, the proportional valve opening can be optionallyadjusted to change the depressurization rate (step 5545).

FIG. 31 is a perspective diagram illustrating a gas delivery apparatus5600 utilizing a reverse flow mode for fast bleed down of anaccumulation volume 5699, according to another alternative embodiment.The gas delivery apparatus 5600 may be used to provide controlleddelivery of a reactant to a semiconductor manufacturing process, forexample. The illustrated alternative gas delivery apparatus 5600includes a gas supply shut-off valve 5602, an upstream cycle purge valve5604, an electronic pressure regulator 5610, and a flow node 5629. Aflow path of the alternative gas delivery apparatus 5600 includes aconduit inlet 5605 receiving downstream to conduits 5615A-D,accordingly, and exhausting downstream to a process at a conduit outlet5625. A preferred embodiment of the gas delivery apparatus 5600 involveslow flow gas delivery which can be characterized as less than 5100 SCCM(standard cubic centimeters per minute) or approximately 4/1000 chemicalmole per minute. Some alternative embodiments comprise more than oneflow node for wider dynamic accuracy (e.g., in a parallelconfiguration).

An accumulated (accumulation) volume 5699 includes at least a portion ofspace within the conduit 5615B between the gas supply shut-off valve5602 and the electronic pressure regulator 5610 combined with at least aportion of space within the conduit 5615C between the electronicpressure regulator 5610 and a flow node 5629. The electronic pressureregulator 5610 includes a pressure transducer 5621 which measures anassociated pressure and also a proportional valve 5620. Spacing withinand between components may also be included in consideration of theaccumulated volume 5699. The flow node 5629 includes a characterizedrestrictor 5630 in series and directly adjacent with a valve seat anddiaphragm which together may function as a downstream outlet shut-offvalve. The illustrated gas delivery apparatus 5600 has a form factorcomprising decentralized components making up a gas stick using a flownode and associated electronic regulator, sensors and control system, asopposed to the gas stick of FIG. 25. The alternative gas deliveryapparatus 5600 illustrates use of metallic tubing and machined surfacemount fluid delivery substrates as known in the semiconductor capitalequipment industry.

A process control system (not shown) may use the gas delivery apparatus5600 in a forward flow mode in the following manner. Process gas entersthrough the inlet conduit 5605 and passes through the gas supply valve5602 into the conduit 5615B upstream of the electronic pressureregulator 5610 while the upstream cycle purge valve 5604 is in a closedcondition. A target pressure set point is provided by the processcontrol system to the electronic pressure regulator 5610 based at leastin part upon a desired mass flow rate to be provided to the process bythe flow node 5629. The electronic pressure regulator 5610 includes thepressure transducer 5621 which measures a pressure within the conduit5615C upstream of the flow node 5629, and adjusts the proportional valve5620 to keep the measured pressure approximately equal to the targetpressure (opening the proportional valve 5620 more if the measuredpressure is too low or reducing the opening of the proportional valve5620 if the pressure is too high). Process gas flows from the conduit5615C upstream of the flow node 5629, into the flow node 5629, andthrough the characterized restrictor 5630 and exhausting downstream to aprocess at a conduit outlet 5625.

The process control system (not shown) may in the following manner usethe gas delivery apparatus 5600 in a reverse flow mode in response toinputs. Changing to reverse flow mode may be done when needing a fastreduction of gas delivery flow rate, for example. The gas supply valve5602 is placed into a closed condition and the upstream cycle purgevalve 5604 is placed into an open condition thereby connecting theconduit 5615B upstream of the electronic pressure regulator 5610 to avacuum suction (sink) thereby reversing the flow supplied to theelectronic pressure regulator 5610 and rapidly reducing the suppliedprocess gas pressure. Strategies for removing process gas from theconduit 5615C between the electronic pressure regulator 5610 and theflow node 5629 may depend upon design of the electronic pressureregulator 5610. For example, temporarily providing a large targetpressure set point to the electronic regulator 5610 will cause a forwardpressure regulator control system to further open the proportional valve5620 thereby allowing process gas to reverse flow leaving the conduit5615C and pass into the vacuum suction (sink) through the cycle purgevalve 5604. Alternatively, the electronic pressure regulator 5610 may bereconfigurable to operate in a back pressure regulation mode. In suchinstance the process control system may provide a new reduced targetpressure set point to the reconfigured pressure regulator 5610 wherebythe pressure transducer 5621, which measures a pressure within theconduit 5615C upstream of the flow node 5629, provides local feedbackand the reconfigured electronic pressure regulator 5610 adjusts theproportional valve 5620 to keep the measured pressure approximatelyequal to the target pressure (reducing the opening of the proportionalvalve 5620 if the measured pressure is too low or increasing the openingof the proportional valve 5620 if the pressure is too high).

FIG. 32 is a perspective diagram illustrating a gas delivery apparatus5700 utilizing a reverse flow mode for fast bleed down of anaccumulation volume 5799, according to yet another embodiment. The gasdelivery apparatus 5700 may be used to provide controlled delivery of areactant to a semiconductor manufacturing process, for example. Theillustrated another gas delivery apparatus 5700 includes a gas supplyshut-off valve 5702, an upstream cycle purge valve 5704, a control valve5720, a pressure transducer 5721, and a flow node 5729. A flow path ofthe alternative gas delivery apparatus 5700 includes a conduit inlet5705 receiving downstream to conduits 5715A-D, accordingly, andexhausting downstream to a process at a conduit outlet 5725. A preferredembodiment of the gas delivery apparatus 5700 involves low flow gasdelivery which can be characterized as less than 100 SCCM (standardcubic centimeters per minute) or approximately 4/1000 chemical mole perminute. Some alternative embodiments comprise more than one flow nodefor wider dynamic accuracy (e.g., in a parallel configuration).

An accumulated (accumulation) volume 5799 includes at least a portion ofspace within the conduit 5715B between the gas supply shut-off valve5702 and the control valve 5720 combined with at least a portion ofspace within the conduit 5715C between the pressure transducer 5721 anda flow node 5729. Spacing within and between components may also beincluded in consideration of the accumulated volume 5799. The flow node5729 includes a characterized restrictor 5730 in series and directlyadjacent with a valve seat and diaphragm which together may function asa downstream outlet shut-off valve. The illustrated gas deliveryapparatus 5700 has a form factor comprising decentralized componentsmaking up a gas stick using a flow node and associated valves, sensorsand control system, as opposed to the gas stick of FIG. 25. Thealternative gas delivery apparatus 5700 illustrates use of metallictubing and machined surface mount fluid delivery substrates as known inthe semiconductor capital equipment industry.

A process control system (not shown) may use the gas delivery apparatus5700 in a forward flow mode in the following manner. Process gas entersthrough the inlet conduit 5705 and passes through the gas supply valve5702 into the conduit 5715B upstream of the control valve 5720 while theupstream cycle purge valve 5704 is in a closed condition. A targetpressure set point may be calculated by the process control system basedat least in part upon a desired mass flow rate to be provided to theprocess by the flow node 5729. Signals from the pressure transducer5721, which measures a pressure within the conduit 5715C upstream of theflow node 5729, are used by the process control system to determineadjustments to the proportional valve 5720 intended to keep the measuredpressure approximately equal to the target pressure (opening theproportional valve 5720 more if the measured pressure is too low orreducing the opening of the proportional valve 5720 if the pressure istoo high). Process gas flows from the conduit 5715C upstream of the flownode 5729, into the flow node 5729, and through the characterizedrestrictor 5730 and exhausting downstream to a process at a conduitoutlet 5725.

The process control system (not shown) may in the following manner usethe gas delivery apparatus 5700 in a reverse flow mode in response toinputs. Changing to reverse flow mode may be done when needing a fastreduction of gas delivery flow rate, for example. The gas supply valve5702 is placed into a closed condition and the upstream cycle purgevalve 5704 is placed into an open condition thereby connecting theconduit 5715B upstream of the control valve 5720 to a vacuum suction(sink) thereby reversing the flow supplied to the control valve 5720 andrapidly reducing the supplied process gas pressure. Strategies forremoving process gas from the conduit 5715C between the control valve5720 and the flow node 5729 may depend upon the inputs which led to useof the reverse flow mode. For example, the process control system maymaximally open the proportional valve 5720 thereby allowing process gasto very rapidly reverse flow leaving the conduit 5715C and pass into thevacuum suction (sink) through the cycle purge valve 5704. Alternatively,the process control system may calculate a new reduced target pressureset point and adjust the proportional valve 5720 to keep the measuredpressure approximately equal to the new reduced target pressure(reducing the opening of the proportional valve 5720 if the measuredpressure is too low or increasing the opening of the proportional valve5720 if the pressure is too high).

While the invention has been described with respect to specificexamples, those skilled in the art will appreciate that there arenumerous variations and permutations of the above described invention.It is to be understood that other embodiments may be utilized andstructural and functional modifications may be made without departingfrom the scope of the present invention. Thus, the spirit and scopeshould be construed broadly as set forth in the appended claims.

What is claimed is:
 1. A system for controlling the delivery of aprocess gas comprising: a first mass flow device comprising: a substrateblock comprising an inlet conduit and an outlet conduit; a proportionalvalve comprising a first valve body mounted to the substrate block andfluidly connected to the inlet conduit; a characterized restrictorfluidly connected to the proportional valve and the outlet conduit; anda valve comprising a second valve body mounted to the substrate blockand fluidly coupled between the proportional valve and the outletconduit; a pressure transducer isolated from the substrate block anddownstream of the outlet conduit of the first mass flow device.
 2. Thesystem of claim 1 wherein the pressure transducer is accessed by one ormore mass flow devices.
 3. The system of claim 1 further comprising aprinted circuit board.
 4. The system of claim 3 wherein the printedcircuit board receives signals from the pressure transducer.
 5. Thesystem of claim 1 wherein the pressure transducer outputs an analogsignal.
 6. The system of claim 1 wherein the pressure transducer outputsa digital signal.
 7. The system of claim 1 further comprising a secondmass flow device, the first and second mass flow devices accessing thepressure transducer.
 8. A system for processing articles comprising: afirst flow controller comprising a first printed circuit board, a firstinlet conduit, a first outlet conduit, a first proportional valvefluidly coupled to the first inlet conduit, and a first characterizedrestrictor coupled between the first proportional valve and the firstoutlet conduit; a second flow controller comprising a second printedcircuit board, a second inlet conduit, a second outlet conduit, a secondproportional valve fluidly coupled to the second inlet conduit and asecond characterized restrictor coupled between the second proportionalvalve and the second outlet conduit, the first and second outletconduits fluidly connected; a pressure transducer fluidly connected tothe first and second outlet conduits; wherein measurements from thepressure transducer are received by the first printed circuit board andthe second printed circuit board.
 9. The system of claim 8 wherein thefirst flow controller comprises a first substrate block, the first inletconduit and the first outlet conduit formed within the first substrateblock.
 10. The system of claim 9 wherein the second flow controllercomprises a second substrate block, the second inlet conduit and thesecond outlet conduit formed within the second substrate block.
 11. Thesystem of claim 10 wherein the pressure transducer is coupled to thefirst substrate block and is isolated from the second substrate block.12. The system of claim 8 further comprising a manifold fluidly couplingthe first outlet conduit, second outlet conduit, and the pressuretransducer.
 13. The system of claim 8 further comprising a toolcontroller electrically coupled to the pressure transducer.
 14. Thesystem of claim 13 wherein the tool controller communicates themeasurements from the pressure transducer to the first and secondprinted circuit boards.
 15. A system for processing articles comprising:a first flow controller comprising a first substrate block, a firstproportional valve mounted to the first substrate block, a first inletconduit, a first characterized restrictor, a first outlet conduit, and apressure transducer mounted to the first substrate block and fluidlyconnected to the first outlet conduit, the pressure transducer fluidlyconnected between the first outlet conduit and the first characterizedrestrictor; a second flow controller comprising a second substrateblock, a second proportional valve mounted to the second substrateblock, a second inlet conduit, a second characterized restrictor, and asecond outlet conduit, the second characterized restrictor locatedbetween the second proportional valve and the second outlet conduit, thefirst and second outlet conduits fluidly connected, the pressuretransducer fluidly connected to the second outlet; wherein measurementsfrom the pressure transducer control operation of the first and secondproportional valves; and wherein the second flow controller is free ofpressure transducers between the second characterized restrictor and thesecond outlet conduit.
 16. The system of claim 15 further comprising atool controller electrically coupled to the pressure transducer.
 17. Thesystem of claim 16 wherein the first flow controller further comprises aprinted circuit board and the second flow controller further comprises aprinted circuit board, the printed circuit boards of the first andsecond flow controllers receiving measurements from the tool controller.18. The system of claim 15 wherein the first flow controller furthercomprises a valve mounted to the first substrate block, the valvefluidly coupled between the first proportional valve and the outletconduit.
 19. The system of claim 15 wherein the measurements from thepressure transducer are transmitted directly from the first flowcontroller to the second flow controller.
 20. The system of claim 15wherein the first inlet conduit and the first outlet conduit are formedin the first substrate block and the second inlet conduit and the secondoutlet conduit are formed in the second substrate block.